Industries / Semiconductor
SEMICONDUCTOR
PRECISION MACHINING
Precision subcomponents for semiconductor equipment.
Parts that demand ultra-high precision, tight flatness and careful material handling.
Focus
Tolerance
Flatness
Micron level

WHAT WE DO
What we machine
-
Precision fixtures
-
Chamber & handling parts
What we focus on
-
Flatness
Aizaki provides semiconductor precision machining for manufacturing and inspection equipment: precision fixtures, chamber and handling parts, and other components. These parts demand ultra-high precision, tight flatness and careful material handling.

OUR PROCEDURE
Five steps, drawing to delivery.
1
Drawing review & DFM feedback
Tolerance stack and cost drivers, in writing
2
Material sourcing with full traceability
Mill certs and lot IDs from the start
3
CNC machining
Milling · turning · 5-axis · grinding · wire EDM
4
Finishing
In-house + global partner network
5
Inspection & delivery
CMM + vision, with documentation
MATERIALS & FINISHES
(Turning and milling typically to ±0.01 mm; grinding and polishing to ±0.005 mm, under controlled conditions. Inch values converted at 1 in = 25.4 mm.)

FAQ
What tolerances can you achieve?
Micron-level tolerances on critical features.
What finishing do you offer?
Clear and hard anodising, electropolishing
Do you machine ceramics and exotic materials?
We machine aluminium, stainless, and technical ceramics such as alumina.
Can you hold high flatness and fine surface finishes?
Yes. Precision grinding and lapping deliver tight flatness and fine finishes on critical surfaces.
Do you machine vacuum-compatible parts?
Yes. Parts are machined and packaged for diverse applications.
CASE STUDY






